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![Thermal compress bonder (TCB-Series)](https://user-images.strikinglycdn.com/res/hrscywv4p/image/upload/c_limit,fl_lossy,h_1000,w_500,f_auto,q_auto/3606521/186576_326009.png)
Thermal compress bonder (TCB-Series)
Specs:
*Bonding Area : Max. 120mm×120mm
*Bonding Pressure: Max. 15,000N
*Tempe. Control: 250℃(top), 300℃(bottom)
*Substrate size : Min. 50mm×50mm
Max. 120mm×120mm
*Dimension: 900(W)×900(D)×1,900(H)mm
*Bonding Area : Max. 120mm×120mm
*Bonding Pressure: Max. 15,000N
*Tempe. Control: 250℃(top), 300℃(bottom)
*Substrate size : Min. 50mm×50mm
Max. 120mm×120mm
*Dimension: 900(W)×900(D)×1,900(H)mm