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PS semi-auto
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Hall Effect Magnet Bench
8801 Room temperature 8802 RT + LN2 8803 Variable magnet field 8804 Trolley type 8805 Probing type
Dual Channel Measuring Unit
a. Tightly integrated, 4-quadrant voltage/current source and measure instruments offer best in class b. performance with 6½-digit resolution c. Family of models offer industry’s widest dynamic range: 10 A pulse to 0.1 fA and 200 V to 100 nV d. Built-in web browser based software enables remote control through any browser, on any computer, from anywhere in the world e. Compatibility with true plug & play I/V characterization and test through any Android device f. TSP (Test Script Processing) technology embeds complete test programs inside the instrument for best in-class system-level throughput g. TSP-Link expansion technology for multi-channel parallel test without a mainframe h. USB 2.0, LXI-C, GPIB, RS-232, and digital I/O interfaces i. Free software drivers and development/debug tools j. Optional ACS-Basic semiconductor component characterization software
Dip Coater(DC606)
* The size of the simple test dip coating machine is about 360*260*520 mm * Lifting speed range: 1~200 mm/min * Fixture diameter: 4mm * Stretching distance: 200~250 mm
HF probe arm - north - south (MWA-NS)
Specs: * Fixing mechanism: nut locking *Angle: ±10° * Contact Stability: Excellent *Suitable for all kinds of probe heads
HF probe arm - east-west ( MWA-EW )
Specs: * Fixing mechanism: nut locking *Angle: ±10° * Contact Stability: Excellent
EFP-804
Feature: *Low resistance material *Soft surface material Specs: *Chuck : 120mm in dia *Build in 4x banana connector *Tip material: BeCu (flat head) *Tip spacing 1.6mm *Tip spring force 40g *Tip travel 1.0mm *Ohm range : 5mΩ~5MΩ *Resolution: 0.1μΩ *Test current: 1A (max) *USB Interface *Measurement software: Sheet resistance, Resistivity
chamber-03
Chamber-02
Adapter-Triaxial Feed-thru
Features • Bulkhead adapter for triax connector. • For used in shielding box or connection panel Specifications • Triax to triax (female to female)
Alloying Furnace (RC-800)
Applicaton: Alloying Contacts To Semiconductor Samples Under Controlled Conditions Features: *Easy access to temperature controlled specimen stage. *Compact furnace for temperatures up to 750°C. *Controlled melting using optical observation system. *In situ oxide removal prior to melting contact material. *Range of alloys available for use with the equipment.
Automatic Pick and Place machine
Application: For all industry which will use blister for package Features: *Very high throughput *High Stable *Modulized design *Less maintenance
Chamber-01
Electromagnet
Motorized stage
Features: * 1D, 2D, 3D, 4D stage are available * High stability * High accuracy * RS232, RS458 available * Control software on request * Customer design is possible
Hot Embossing Machine (HE200)
Features: *vacuum_chuck *Hot plate *Wafer holder
Dip coater (DC600)
Specs: * Dip speed :1~200mm/min。 * Dip range :1~200mm。 * sample loading < 1000g。 * Controlled by computer * Working for 100mmx100mm, 60mmx48mm sample zise * Customer need prepare desktop computer by themselves * Solution container provided by customer
Dip coater (DC500)
Specs: * Dip speed :1~200mm/min。 * Dip range :1~200mm。 * sample loading < 1000g。 * Controlled by PLC * Sample size need provided in advance * Solution container provided by customer
Dip coater (DC502)
Specs: * Dip speed :1~200mm/min。 * Travel range :1~200mm。 * sample loading < 1000g。 * Controlled by PLC * Touch panel human interface * Support Diping and drying function * Drying temperature and time setting * Solution container provided by customer Options: *Multi-speed
Dip Coater (DC501)
Specs: * Dip speed :1~200mm/min。 * Travel range :1~200mm。 * sample loading < 1000g。 * Controlled by PLC * Touch panel human interface * Heating temperature up to 150 deg C * Solution container provided by customer
Flood Exposurer (FE series)
Features: • Flood exposure application • No alignment system • No imaging system • Wafer size : 4", 6", 8" • Lamp power : 350W, 500W, 1 000W • Spectrum : NUV (300nm~400nm) • High quality exposure optics • Wedge Error Compensation (WEC) • Precise gap setting
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